Reference

PCB Glossary

Every term you'll hear on a sales call, in plain English.

A

Annular Ring

The ring of copper around a drilled hole that connects it to a trace or pad.

A

AOI

Automated Optical Inspection — a vision system that checks component placement on a PCBA after the reflow oven.

A

AS9100

Quality management standard for the aerospace industry. Required for most aerospace and defense work.

A

AVL

Approved Vendor List — the list of pre-qualified suppliers a company is allowed to buy from.

B

BOM

Bill of Materials — the list of every component needed to assemble a board, with part numbers, manufacturers, and quantities.

B

Box Build

Full system integration: putting a PCBA into an enclosure with cables, displays, fans, and other parts to create a finished product.

C

Conformal Coating

A protective spray applied to a finished PCBA to shield it from moisture, dust, and chemicals.

C

Controlled Impedance

A trace designed to a specific impedance value (often 50Ω) to maintain signal integrity at high speeds.

C

CPL File

Component Placement List (or Pick-and-Place file) — tells the assembly robot the X-Y coordinates and rotation of every component.

D

DFM

Design for Manufacturability — checking a design against fabrication capabilities to avoid yield issues.

E

EMS

Electronic Manufacturing Services — companies that assemble PCBAs (and often full products) for OEMs. Also called contract manufacturers (CMs).

E

ENIG

Electroless Nickel Immersion Gold — a flat, gold-colored surface finish ideal for fine-pitch components.

F

FAI

First Article Inspection — a documented inspection of the first unit produced, used to qualify a new supplier or revision.

F

FR-4

Flame Retardant 4 — the standard glass-reinforced epoxy laminate used as a PCB substrate. The default for ~90% of rigid boards.

G

Gerber

The standard 2D file format used to describe each layer of a PCB to the fabricator.

G

Gold Fingers

Gold-plated stripes along the edge of a PCB used for plugging into a slot connector (e.g. RAM modules).

H

HASL

Hot Air Solder Leveling — an inexpensive surface finish that coats copper pads with solder. Available in tin-lead and lead-free.

H

HDI

High Density Interconnect — boards with very fine traces, microvias, and stacked vias. Found in smartphones and advanced wearables.

I

IATF 16949

Quality management standard for the automotive industry.

I

ICT

In-Circuit Test — an electrical test of a populated board using a bed-of-nails fixture to verify each component.

I

IPC

The trade association whose standards define PCB acceptability (IPC-A-600 for bare boards, IPC-A-610 for assemblies) and reliability classes 1–3.

I

IPC Class 2

Dedicated service electronics — most industrial and consumer products. The most common quality class.

I

IPC Class 3

High-reliability electronics — medical, aerospace, military. Strictest IPC requirements.

I

ISO 13485

Quality management standard for medical device manufacturing.

I

ISO 9001

General quality management system certification. Table-stakes for most B2B suppliers.

I

ITAR

International Traffic in Arms Regulations — U.S. export controls on defense-related items. Required for many DoD programs.

M

MCPCB

Metal-Core PCB — uses an aluminum or copper base instead of FR-4 to pull heat away from components. Dominant in LED lighting.

M

MEDDPICC

A B2B sales qualification framework: Metrics, Economic buyer, Decision criteria, Decision process, Paper process, Identify pain, Champion, Competition.

M

Microvia

A very small laser-drilled via, typically used in HDI boards to connect adjacent layers.

N

NCR

Non-Conformance Report — documentation of a defect or deviation, used to track supplier quality issues.

N

NPI

New Product Introduction — the phase between prototype and full production where a design is being ramped up.

N

NRE

Non-Recurring Engineering — one-time setup costs for a new program (tooling, stencils, test fixtures, FAI).

O

OEM

Original Equipment Manufacturer — the brand that designs and sells the end product (Apple, Tesla, Medtronic, etc.).

O

OSP

Organic Solderability Preservative — a cheap, environmentally friendly surface finish with a shorter shelf life.

P

Panel

The larger sheet of material that multiple individual PCBs are fabricated on simultaneously.

P

PCBA

Printed Circuit Board Assembly — a PCB with all components soldered on. Sometimes called a 'loaded,' 'stuffed,' or 'populated' board.

P

Pick-and-Place

The robot in an SMT line that places thousands of components per hour onto solder paste on a board.

P

Prepreg

Pre-impregnated glass fabric used to bond layers together in a multilayer PCB. It melts and cures during lamination.

P

PTH

Plated Through-Hole — a hole drilled through a board and plated with copper to connect layers or accept a component lead.

R

Reflow Oven

An oven that heats a populated board through a controlled temperature profile, melting solder paste to bond components.

R

RFQ

Request for Quote — a customer's formal request for pricing on a specific board and quantity.

R

Rogers

A brand of low-loss laminate materials commonly used for high-frequency and RF PCBs.

R

RoHS

Restriction of Hazardous Substances — a European directive requiring lead-free electronics. Widely adopted globally.

S

Silkscreen

The printed (usually white) layer that labels components, polarities, and reference designators on a PCB.

S

SMT

Surface-Mount Technology — assembly method where components sit flat on the board surface instead of through holes.

S

Soldermask

The protective coating (usually green) applied over copper to prevent shorts and oxidation.

S

Stackup

The arrangement of copper and dielectric layers that make up a multilayer PCB.

S

Substrate

The insulating base material of a PCB (typically FR-4) that copper traces sit on.

T

Trace

A copper line on a PCB that carries electrical current between two points.

U

UL

Underwriters Laboratories — a safety certification often required for PCBs sold in North America.

V

Via

A plated hole that connects copper on different layers of a PCB. Types include through-hole, blind, and buried.