PCB Glossary
Every term you'll hear on a sales call, in plain English.
Annular Ring
The ring of copper around a drilled hole that connects it to a trace or pad.
AOI
Automated Optical Inspection — a vision system that checks component placement on a PCBA after the reflow oven.
AS9100
Quality management standard for the aerospace industry. Required for most aerospace and defense work.
AVL
Approved Vendor List — the list of pre-qualified suppliers a company is allowed to buy from.
BOM
Bill of Materials — the list of every component needed to assemble a board, with part numbers, manufacturers, and quantities.
Box Build
Full system integration: putting a PCBA into an enclosure with cables, displays, fans, and other parts to create a finished product.
Conformal Coating
A protective spray applied to a finished PCBA to shield it from moisture, dust, and chemicals.
Controlled Impedance
A trace designed to a specific impedance value (often 50Ω) to maintain signal integrity at high speeds.
CPL File
Component Placement List (or Pick-and-Place file) — tells the assembly robot the X-Y coordinates and rotation of every component.
DFM
Design for Manufacturability — checking a design against fabrication capabilities to avoid yield issues.
EMS
Electronic Manufacturing Services — companies that assemble PCBAs (and often full products) for OEMs. Also called contract manufacturers (CMs).
ENIG
Electroless Nickel Immersion Gold — a flat, gold-colored surface finish ideal for fine-pitch components.
FAI
First Article Inspection — a documented inspection of the first unit produced, used to qualify a new supplier or revision.
FR-4
Flame Retardant 4 — the standard glass-reinforced epoxy laminate used as a PCB substrate. The default for ~90% of rigid boards.
Gerber
The standard 2D file format used to describe each layer of a PCB to the fabricator.
Gold Fingers
Gold-plated stripes along the edge of a PCB used for plugging into a slot connector (e.g. RAM modules).
HASL
Hot Air Solder Leveling — an inexpensive surface finish that coats copper pads with solder. Available in tin-lead and lead-free.
HDI
High Density Interconnect — boards with very fine traces, microvias, and stacked vias. Found in smartphones and advanced wearables.
IATF 16949
Quality management standard for the automotive industry.
ICT
In-Circuit Test — an electrical test of a populated board using a bed-of-nails fixture to verify each component.
IPC
The trade association whose standards define PCB acceptability (IPC-A-600 for bare boards, IPC-A-610 for assemblies) and reliability classes 1–3.
IPC Class 2
Dedicated service electronics — most industrial and consumer products. The most common quality class.
IPC Class 3
High-reliability electronics — medical, aerospace, military. Strictest IPC requirements.
ISO 13485
Quality management standard for medical device manufacturing.
ISO 9001
General quality management system certification. Table-stakes for most B2B suppliers.
ITAR
International Traffic in Arms Regulations — U.S. export controls on defense-related items. Required for many DoD programs.
MCPCB
Metal-Core PCB — uses an aluminum or copper base instead of FR-4 to pull heat away from components. Dominant in LED lighting.
MEDDPICC
A B2B sales qualification framework: Metrics, Economic buyer, Decision criteria, Decision process, Paper process, Identify pain, Champion, Competition.
Microvia
A very small laser-drilled via, typically used in HDI boards to connect adjacent layers.
NCR
Non-Conformance Report — documentation of a defect or deviation, used to track supplier quality issues.
NPI
New Product Introduction — the phase between prototype and full production where a design is being ramped up.
NRE
Non-Recurring Engineering — one-time setup costs for a new program (tooling, stencils, test fixtures, FAI).
OEM
Original Equipment Manufacturer — the brand that designs and sells the end product (Apple, Tesla, Medtronic, etc.).
OSP
Organic Solderability Preservative — a cheap, environmentally friendly surface finish with a shorter shelf life.
Panel
The larger sheet of material that multiple individual PCBs are fabricated on simultaneously.
PCBA
Printed Circuit Board Assembly — a PCB with all components soldered on. Sometimes called a 'loaded,' 'stuffed,' or 'populated' board.
Pick-and-Place
The robot in an SMT line that places thousands of components per hour onto solder paste on a board.
Prepreg
Pre-impregnated glass fabric used to bond layers together in a multilayer PCB. It melts and cures during lamination.
PTH
Plated Through-Hole — a hole drilled through a board and plated with copper to connect layers or accept a component lead.
Reflow Oven
An oven that heats a populated board through a controlled temperature profile, melting solder paste to bond components.
RFQ
Request for Quote — a customer's formal request for pricing on a specific board and quantity.
Rogers
A brand of low-loss laminate materials commonly used for high-frequency and RF PCBs.
RoHS
Restriction of Hazardous Substances — a European directive requiring lead-free electronics. Widely adopted globally.
Silkscreen
The printed (usually white) layer that labels components, polarities, and reference designators on a PCB.
SMT
Surface-Mount Technology — assembly method where components sit flat on the board surface instead of through holes.
Soldermask
The protective coating (usually green) applied over copper to prevent shorts and oxidation.
Stackup
The arrangement of copper and dielectric layers that make up a multilayer PCB.
Substrate
The insulating base material of a PCB (typically FR-4) that copper traces sit on.
Trace
A copper line on a PCB that carries electrical current between two points.
UL
Underwriters Laboratories — a safety certification often required for PCBs sold in North America.
Via
A plated hole that connects copper on different layers of a PCB. Types include through-hole, blind, and buried.